1. 2. 3. material content data sheet sales product name bsb013ne2lxi issued 19. november 2015 ma# MA000887544 package mg-wdson-2-8 weight* 83.36 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.882 4.66 4.66 46575 46575 leadframe non noble metal copper 7440-50-8 74.415 89.29 89.29 892741 892741 leadfinish non noble metal nickel 7440-02-0 0.211 0.25 2534 noble metal silver 7440-22-4 0.840 1.01 1.26 10077 12611 plating non noble metal nickel 7440-02-0 0.211 0.25 0.25 2534 2534 glue plastics epoxy resin - 0.178 0.21 2138 noble metal silver 7440-22-4 1.095 1.31 1.52 13136 15274 solder non noble metal copper 7440-50-8 0.011 0.01 132 noble metal silver 7440-22-4 0.066 0.08 790 non noble metal tin 7440-31-5 2.119 2.54 2.63 25416 26338 passivation plastics epoxy resin - 0.327 0.39 0.39 3927 3927 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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